january 2010 doc id 16934 rev 1 1/8 8 2N5401HR hi-rel pnp bipolar transistor 150 v - 0.5 a features hi-rel pnp bipolar transistor linear gain characteristics escc qualified european preferred part list - eppl radiation level: lot specific total dose contact marketing for specified level description the 2N5401HR is a silicon planar epitaxial pnp transistor in to-18 and lcc-3 packages. it is specifically designed for aerospace hi-rel applications and escc qualified according to the 5202-014 specification. in case of conflict between this datasheet and escc detailed specification, the latter prevails. figure 1. internal schematic diagram bv ceo 150 v i c (max) 0.5 a h fe at 10 v - 150 ma > 60 operating temperature range -65c to +200c to-18 lcc-3 3 1 2 1 3 2 table 1. device summary order codes packages lead fini sh marking type eppl packaging 2N5401HR to-18 gold solder dip 520201401 520201402 escc flight strip pack 2n5401t1 to-18 gold 2n5401t1 engineering model strip pack soc5401 lcc-3 gold soc5401 engineering model waffle pack soc5401hrb lcc-3 gold solder dip 520201404 520201405 escc flight yes waffle pack www.st.com
electrical ratings 2N5401HR 2/8 doc id 16934 rev 1 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit v cbo collector-base voltage (i e = 0) -160 v v ceo collector-emitter voltage (i b = 0) -150 v v ebo emitter-base voltage (i c = 0) -5 v i c collector current for 2N5401HR for soc5401hrb -0.6 -0.5 a a p tot total dissipation at t amb 25 c for 2N5401HR for soc5401hrb for soc5401hrb (1) total dissipation at t c 25 c for 2N5401HR 1. when mounted on a 8x10x0.6 mm ceramic substrate. 0.36 0.36 0.58 1.2 w w w w t stg storage temperature -65 to 200 c t j max. operating junction temperature 200 c table 3. thermal data for through-hole package symbol parameter value unit r thjc r thja thermal resistance junction-case __ max thermal resistance junction-ambient __ max 146 486 c/w c/w table 4. thermal data for smd package symbol parameter value unit r thja thermal resistance junction-ambient __ max thermal resistance junction-ambient (1) __ max 1. when mounted on a 8x10x0.6 mm ceramic substrate. 486 302 c/w c/w
2N5401HR electrical characteristics doc id 16934 rev 1 3/8 2 electrical characteristics t case = 25 c unless otherwise specified. table 5. electrical characteristics symbol parameter test conditions min. typ. max. unit i cbo collector-base cut-off current (i e = 0) v cb = -120 v v cb = -120 v t c = 150 c -50 -50 na a i ebo emitter-base cut-off current (i c = 0) v eb = -3 v -50 na v (br)cbo collector-base breakdown voltage (i e = 0) i c = -100 a -160 v v (br)ceo (1) 1. pulsed duration = 300 s, duty cycle 2 % collector-emitter breakdown voltage (i b = 0) i c = -1 ma -150 v v (br)ebo emitter-base breakdown voltage (i c = 0) i e = -10 a -5 v v ce(sat) (1) collector-emitter saturation voltage i c = -10 ma i b = -1 ma i c = -50 ma i b = -5 ma -0.2 -0.5 v v v be(sat) (1) base-emitter saturation voltage i c = -10 ma i b = -1 ma i c = -50 ma i b = -5 ma -1 -1 v v h fe (1) dc current gain i c = -1 ma v ce = -5 v i c = -10 ma v ce = -5 v i c = -50 ma v ce = -5 v i c = -10 ma v ce = -5 v t amb = -55 c 50 60 60 20 240 h fe small signal current gain v ce = -10 v i c = -10 ma f = 10 khz 5 c obo output capacitance (i e = 0) v cb = -10 v f = 1 mhz 6 pf
package mechanical data 2N5401HR 4/8 doc id 16934 rev 1 3 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark.
2N5401HR package mechanical data doc id 16934 rev 1 5/8 0041211j ceramic leadle ss chip carrier 3 mechanical data dim. mm. min. typ max. a1.16 1.42 c 0.45 0.50 0.56 d0.76 e1 f1. 9 02.15 g2. 9 0 3 .25 i2.40 2.74 j 0.40 0.57 0. 8 0 k1. 3 51.521.75 l0.50 m2.40 2.65 n1. 9 0 r0. 3 0
package mechanical data 2N5401HR 6/8 doc id 16934 rev 1 d
2N5401HR revision history doc id 16934 rev 1 7/8 4 revision history table 6. document revision history date revision changes 04-jan-2010 1 initial release
2N5401HR 8/8 doc id 16934 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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